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Single Wire Saw Product List

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What is a "cutting technology" single wire saw?

Processing of large-diameter materials and thick plates, which are difficult to process with a multi-wire saw, is possible! This significantly reduces processing loss of expensive materials.

We also have single wire saws in addition to multi-wire saws. With the single wire saw, it is possible to process large diameter materials and thick plates that are difficult to process with multi-wire saws. By adopting a fixed abrasive method using diamond wire, we can significantly reduce processing loss of expensive materials. 【Main compatible materials】 Aluminum Nitride AlN / Alumina Al2O3 / Sapphire / Silicon Carbide SiC / Copper Cu / Molybdenum Mo / Tungsten W / Copper Molybdenum / Copper Tungsten / Quartz Glass / Lithium Niobate LiNbO3 / Lithium Tantalate LiTaO3 / Barium Titanate BaTiO3 / Zirconia ZrO2 / Silicon Nitride Si3N4 / Cemented Carbide / Ceramic Matrix Composites (CMC) / Crystalline materials (Si, SiC, GaN, etc.) *For more details, please download the PDF catalog or feel free to contact us.

  • Processing Contract
  • Wafer processing/polishing equipment
  • Circuit board processing machine
  • Single Wire Saw

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